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With Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (https://www.stcmicro.com/datasheet/STC15F2K60S2-en.pdf#page=156), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4160, 16 Pins per row.

• Vertex -1.043264e+02 1.007833e+02 1.608622e+01.
• HLE-129-02-xxx-DV-LC, 29 Pins per.

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