Labels Milestones
BackTracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ri_soic_ic/ri_16_1.pdf), generated with kicad-footprint-generator JST XH series connector, S10B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST XH series connector, B15B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf.
- 10.0771 -0.373379 2.58057 vertex -9.81063 -2.33215 2.58057 facet.
- Normal 3.103493e-01 3.586279e-03 -9.506158e-01 vertex -1.081708e+02 9.725134e+01.
- 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu.