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Raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CM.PDF DFN, 14 Pin Vertical EPCOS-B66359J1014T AUDIO TRAFO LUNDAHL, https://www.lundahltransformers.com/wp-content/uploads/datasheets/1538_8xl.pdf AUDIO TRAFO LUNDAHL, https://www.lundahltransformers.com/wp-content/uploads/datasheets/1538_8xl.pdf AUDIO TRAFO LUNDAHL, https://www.lundahltransformers.com/wp-content/uploads/datasheets/1538_8xl.pdf AUDIO TRAFO LUNDAHL, https://www.lundahltransformers.com/wp-content/uploads/datasheets/1587.pdf Transformer, Transformator, ETD29, 14 Pin, Vertical, EPCOS-B66359J1014T, Transformer Transformator ETD29 13 Pin Horizontal EPCOS-B66359A1013T Transformer, Transformator, ETD29, 13 Pin, Horizontal, EPCOS-B66359A1013T, Transformer Transformator ETD29 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32), generated with kicad-footprint-generator Inductor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB cutout, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic DIL, 4.3x4.65mm², RM5.08 PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Siemens SFH900 reflex photo interrupter SMD PhotoDiode, plastic SMD DIL PhotoDiode, plastic SMD DIL PhotoDiode, plastic SMD SmatDIL PhotoDiode plastic.

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