3
1
Back

TSSOP, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CD), generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 top entry JST SH series connector, B11B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.15 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.9mm.

New Pull Request