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Sunlord, MWSA22xxS, 22.0mmx23.5mm, https://sunlordinc.com/Download.aspx?file=L1VwbG9hZEZpbGVzL1BERl9DYXQvMjAyMjExMTUxNDQ4MDU0NTQucGRm&lan=en Inductor, Sunlord, SWRB1205S, 12.5x12.5x6.0mm, https://www.sunlordinc.com/Download.aspx?file=L1VwbG9hZEZpbGVzL1BERl9DYXQvMjAyMTA2MTAxMTMyMzc4MTEucGRm&lan=en Inductor, TDK, MLZ2012_h1.25mm, 2.0x1.25x1.25mm, "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz2012_en.pdf" Inductor,TDK, VLS-6045, 6x6x4.5mm, https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_power_vls6045ex_en.pdf inductor TDK VLP smd VLP8040 Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-24xx, 2.4mmx2.4mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-3030, 3.0mmx3.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-2020, 2.0mmx2.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-1616, 1.6mmx1.6mm inductor taiyo-yuden md smd Inductor, Wuerth Elektronik, WE-PD, SMT, Typ M, Typ S, https://katalog.we-online.com/pbs/datasheet/744878001.pdf, https://katalog.we-online.de/pbs/datasheet/744877001.pdf Choke Coupled Double Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0930, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package - 3x3 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm.

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