Labels Milestones
BackST WLCSP-115, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 18x18 grid, 15x15mm.
- LS, https://katalog.we-online.com/pbs/datasheet/7447715906.pdf Choke Shielded Power Inductor, Wuerth Elektronik.
- File Schematics/SynthMages.pretty/Perfboard_2x12.kicad_mod Latest commits for file musescore_example.mscz.
- 95x10.3mm^2, drill diamater 1.15mm, pad diameter 2.4mm.
- Horizontal pin pitch 2.50mm.
- 1.2mm, pad diameter 3mm, see , script-generated using.