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Mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 24 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 14 leads; body width 4.4 mm; thermal pad.

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