Labels Milestones
Back600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 2.54mm TO-220-5, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 1.27mm Multiwatt-7 staggered type-1 TO-220-4, Horizontal, RM 2.54mm, staggered type-1 TO-220-11, Horizontal, RM.
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