Labels Milestones
Back0.8 SBG485 SBV485 LFCSP, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24.
- Connector, 53780-0370 (), generated.
- Normal 0.462436 -0.865129 0.19418 facet normal -1.822410e-15 7.910530e-01.
- 2bd01a1ff2d30ca3cff647bbf3b80645437cc07c Mon Sep 17.