Labels Milestones
Back06 top-side contacts, 0.5mm pitch, 1.854mm thermal pad 3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch.
- -0.866031 -1.51183e-05 facet normal 0.0974419.
- Type-2 TO-220F-9, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1.