Labels Milestones
BackPitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin.
- Assembly notes for v1 front panel 24ca7abc85681936397a2802c8155420fcaf679c
- Pitch=33.27mm, , diameter=50.8mm, Vishay, IHB-6.
- Vertex -9.341938e+01 9.290015e+01 4.255000e+01.