Labels Milestones
BackSunlord, MWSA0518, 5.4mmx5.2mm TDK NLV25, 2.5x2.0x1.8mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv25-ef_en.pdf tdk nlv25 nlcv25 nlfv25 TDK NLV32, 3.2x2.5x2.2mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv32-ef_en.pdf tdk nlv32 nlcv32 nlfv32 Inductor, TDK, MLZ2012_h0.85mm, 2.0x1.25x0.85mm, "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz2012_en.pdf" Inductor, TDK, SLF12565, 12.5mmx12.5mm (Script generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 5569-08A1, example for new mpn: 39-28-x14x, 7 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 64-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZR0009 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3.
New Pull Request