Labels Milestones
Back1x01, 2.00mm pitch, single row Surface mounted pin header SMD 1x32 1.00mm single row Through hole straight pin header, 2x36, 1.27mm pitch, double rows Through hole pin header SMD 1x36 1.27mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x18 1.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x04 2.54mm double row Through hole straight pin header, 2x36, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header, 2x02, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x29, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x31 2.54mm single row style1 pin1 left Surface mounted pin header SMD 2x32 1.27mm double row Through hole straight pin header, 2x39, 1.00mm pitch, double rows Through hole socket strip THT 2x18 1.27mm double row Through hole pin header SMD 1x06 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x33, 2.54mm pitch, 6mm pin length, single row Through hole angled socket strip, 2x34, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled socket strip, 2x17, 1.27mm pitch, double rows Through hole angled socket strip THT 1x24 1.00mm single row Through hole pin header THT 1x33 2.54mm single row Surface mounted pin header SMD 2x30 1.00mm double row Through hole pin header SMD 2x22 1.00mm double row Through hole straight socket strip, 2x39, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Stretched Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 56 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Small Outline (SS)-5.30 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF.
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