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Number: 5566-14A2, example for new part number: A-41792-0010 example for new part number: 22-27-2091, 9 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xxx-DV-A, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex Pico-EZmate_Slim side entry Molex PicoBlade Connector System, 53047-0610, 6 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator ipc_noLead_generator.py 14-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://cache.freescale.com/files/shared/doc/package_info/98ASS23330W.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.635mm pitch (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP 132 Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP 132 Intel 386EX PQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-10DS-0.5V, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector Hirose BM24 series connector, B8B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator JST SH series connector, B13B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RI_20_1.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1530, 15 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0190, 19 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 52 Pin (JEDEC MO-194 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator JST PH series connector, S5B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0003 example for new mpn: 39-30-0140, 7 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Hirose.

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