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1 FG484 FGG484 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, YZR pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41 Pin (http://www.ti.com/lit/ml/mpqf506/mpqf506.pdf QFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 3 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm TO-92Flat package, often used for a single 1.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PH series connector, B12B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=39), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0830, 8 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-105-02-xxx-DV-BE, 5 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-U (6032-15 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator JST PUD series connector, SM10B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 2, Wuerth electronics 9774060951 (https://katalog.we-online.de/em/datasheet/9774060951.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xxx-DV-BE-A, 39 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, B14B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105310-xx16, 8 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator connector Molex Mini-Fit_Jr top entryplastic_peg Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-24A, example for new part number.

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