Labels Milestones
BackIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row.
- Pitch=2.50mm 5.00mm, , diameter=10mm, Fastron.
- 451mil 6-lead surface-mounted (SMD) DIP package.
- 3314G, http://www.bourns.com/docs/Product-Datasheets/3314.pdf Potentiometer, vertical, shaft hole, ACP.
- Retained by the cone indents.
- For: GMSTBVA_2,5/4-G; number of pins: 02.