Labels Milestones
BackSPST Omron_A6S-710x, Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 10.8x21.88mm 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST CTS_Series194-3MSTN, Piano, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of.