Labels Milestones
BackPin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/ mosfet hsof toll thermal vias in pads, 2.
- -4.83683 -4.97711 6.93683 vertex 4.90011 4.90011 6.9357.
- 0.0560523 -0.995037 facet normal 9.460993e-001 3.238766e-001.
- 1.1mm, pad diameter 3mm, see , script-generated.
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- 7.5mm holes, not 6mm alpha pots .