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2.61x2.88mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x07, 2.00mm pitch, single row Surface mounted pin header THT 2x21 1.27mm double row Through hole IDC header, 2x10, 2.54mm pitch, double rows Through hole straight pin header, 2x11, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole socket strip THT 1x29 1.27mm single row style2 pin1 right Through hole angled socket strip, 1x38, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x24 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x23 1.27mm double row Through hole angled socket strip, 2x34, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header, 2x29, 1.27mm pitch, single row Surface mounted pin header SMD 1x29 1.00mm single row Surface mounted pin header THT 2x18 2.00mm double row Through hole angled socket strip SMD 2x10 1.27mm double row Connector IDC Locked, 10 contacts, compatible header: PANCON HE10 (Series 50, (https://www.reboul.fr/storage/00003af6.pdf Through hole socket strip THT 2x25 1.27mm double row Through hole angled pin header, 1x04, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, see http://www.vishay.com/docs/88656/kbu4.pdf Vishay KBU rectifier package, 5.08mm pitch, single row Through hole Samtec HPM power header series 3.81mm post length, 1x01, 5.08mm pitch, single row style2 pin1 right Through hole pin header SMD 1x33 1.00mm single row Through hole angled pin header, 2x09, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x11 1.00mm single row Surface mounted pin header THT 1x29 1.27mm single row style2 pin1 right Through hole straight pin.

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