Labels Milestones
Back0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm SSOP-8 2.95x2.8mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator.
- 0.99516 facet normal 3.318493e-001 -5.689145e-001 7.524708e-001 vertex 2.103856e+000.
- -6.326916e-01 facet normal -0.0950763 -0.0293641 0.995037.
- 14x14mm package, pitch 0.4mm; see.
- 2.856946e-003 8.032898e-001 facet normal.
- Outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic.