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Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

• 8.034062e-14 facet normal -0.165337 0.688668 0.705975 facet normal.
• HEXDIP DirectFET L4 MOSFET Infineon DirectFET M2 MOSFET.
• "Pots, switches, misc" plated through holes are merged.
• Bourns SRP1770TA series SMD inductor https://www.bourns.com/pdfs/SRR1208.pdf Bourns.

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