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Back(A-screw), horizontal PCB mount, https://www.neutrik.com/en/product/nc4mamh-ph A Series, 5 pole male XLR receptacle, grounding: separate ground contact to mating connector shell to pin1 and front panel, horizontal PCB mount, black chrome shell, https://www.neutrik.com/en/product/nc3mbhl-b B Series, 5 pole male XLR receptacle, grounding: mating connector shell and front panel, horizontal PCB mount, additional ground contacts, https://www.neutrik.com/en/product/nc3mbh-e B Series, 3 pole XLR female receptacle with 6.35mm (1/4in) jack receptacle, vertical pcb mount, replaces NL4MD-H, NL4MD-H-1, NL4MD-H-3, https://www.neutrik.com/en/product/nl4mdxx-h-3 speakON Chassis Connectors, 4 pole female XLR receptacle, grounding: mating connector shell and front panel. Possibly do as an edge cut? Corrected in Rev 2.0 alpha 1: Properly assign potentiometer pads and trace routing to de-bodge the pots. 6523065365c12ceda76dbda25c5041018c73eb63 's notes on repique/caixa, two or three for surdos paper "A4") Add Kick as separate sheet ## Photos ### Photos ## Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md) How to apply the Apache License, Version 2.0 (the "License"); MIT License Copyright (C) 2014 Kevin Ballard Permission is hereby granted, free of charge, to any person obtaining a copy of the contents of the potentiometer pads and thermal vias; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.8mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8.
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- Strip, HLE-123-02-xxx-DV-BE, 23 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.