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BackPitch 2.54 SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm SSOP-8 2.95x2.8mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT1746-3.pdf), generated with kicad-footprint-generator XP_POWER IHxxxxDH DIP DCDC-Converter XP_POWER IHxxxxS, SIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated.
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