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B/Panels/Futura XBlk BT.ttf create mode 100644 3D Printing/Rails/18hp_innie.stl | Bin 0 -> 36336 bytes create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/PinSocket_1x10_P2.54mm_Vertical.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/LED_D5.0mm.kicad_mod create mode 100644 3D Printing/Panels/Radio_shaek_standoff.stl create mode 100644 Synth_Manuals/LABOR_MANUAL.pdf create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Pot_Hole.kicad_mod create mode 100644 Hardware/PCB/precadsr/precadsr.kicad_pro create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alpha_RA6020F_Single_Slide.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIP-14_W7.62mm_Socket_LongPads.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_symbols.lib delete mode 160000 rename from Futura Heavy BT.ttf => Panels/Futura Heavy BT.ttf From f80e4975fbba2affa8a7d947f9ed8429315837d4 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add panels Panels/FireballSpell.png | Bin 0 -> 16700 bytes .../Panels/SPIDER CLIMB.png | Bin 0 -> 38764 bytes Panels/futura medium condensed bt.ttf' ## Current draw 12 mA +12 V, 10 mA -12 V Add html test version Add html test version b22080a808 More experimentation with panel alignment before printing 9a2ab6dc7f initial notes for v1 build - C1 is too small for a pot, an LED, and a "work based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF ATPAK SMD package, tab to pin 1, https://www.wolfspeed.com/media/downloads/137/C3D06060G.pdf D2PAK DDPAK TO-263 D2PAK-3 TO-263-3 SOT-404 diode TO-263 / D2PAK / DDPAK SMD package, orientation marker at anode, https://dammedia.osram.info/media/resource/hires/osram-dam-5824137/SFH%204257_EN.pdf LED PLCC-2 SMD TOPLED LED PLCC-2 SMD package, http://rohmfs.rohm.com/en/techdata_basic/ic/package/hrp7_1-e.pdf, http://rohmfs.rohm.com/en/products/databook/datasheet/ic/motor/dc/bd621x-e.pdf SC-59, hand-soldering varaint.

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