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Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.

45.5x7.6mm^2, drill diamater 1.2mm.
9.567809e-001 facet normal -2.930761e-004 -5.076226e-004 -9.999998e-001.
Pins U-DFN2510-10 package used by this.
Tweaks Final-ish tweaks More.

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