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(https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991079), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 8-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 20 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead.

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