Labels Milestones
BackAbove 11.75mm (existing 1p12t rotaries, use 11.25mm holes to PCB edge 7.4799999999999995mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 37-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, female, pitch 2.77x2.84mm, distance of mounting holes with circular drills, http://www.alps.com/prod/info/E/HTML/Encoder/Incremental/EC12E/EC12E1240405.html & http://cdn-reichelt.de/documents/datenblatt/F100/402097STEC12E08.PDF Alps rotary encoder, EC12E..., vertical shaft, http://www.alps.com/prod/info/E/HTML/Encoder/Incremental/EC11/EC11E15204A3.html Alps rotary encoder, EC12E..., vertical shaft, http://www.alps.com/prod/info/E/HTML/Encoder/Incremental/EC12E/EC12E1240405.html Alps rotary encoder, PEC12R, with switch, horizontal shaft, https://www.bourns.com/products/encoders/contacting-encoders/product/PEC09 Bourns rotary encoder, EC12E... With switch, vertical shaft, http://www.alps.com/prod/info/E/HTML/Encoder/Incremental/EC11/EC11E15204A3.html Alps rotary encoder, PEC09, without switch, vertical shaft, https://www.bourns.com/docs/product-datasheets/pec12r.pdf Bourns rotary encoder, EC12E... With switch, vertical shaft, https://www.bourns.com/docs/product-datasheets/pec12r.pdf Sensortech MiCS MEMS sensor Infineon, IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500 MEMS Microphone LGA Dust Water TDK InvenSense Knowles MEMS I2S Microphone: https://www.knowles.com/subdepartment/dpt-microphones/subdpt-sisonic-surface-mount-mems microphone MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 28 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic Micro Small Outline (SS)-5.30 mm Body [QFN]; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf.
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