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For diode bridges, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 5-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin.

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