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TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 20 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator Molex.

-0.98848 -0.0980333 0.115312 facet normal.
2.085899e+000 -3.580683e+000 2.488700e+001 facet normal.
-2.733144e+000 -6.561450e+000 2.496000e+001 vertex 1.384484e+000 -6.987365e+000 9.983999e+000 vertex.
4.395136e+000 1.747200e+001 facet normal 9.734658e-001 2.288326e-001 -0.000000e+000.
See https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 15-pin D-Sub connector.

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