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Pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [TSSOP] with exposed pad Micrel MLF, 8 Pin (https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7), generated with.

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