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On http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27 FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 1006 3 pins Ceramic Resomator/Filter 10.0x5.0mm^2 RedFrequency MG/MT/MX series, http://www.red-frequency.com/download/datenblatt/redfrequency-datenblatt-ir-zta.pdf, length*width=10.0x5.0mm^2 package, package length=8.0mm, package width=3.0mm, 3 pins THT ceramic resonator filter DSS6 SMD Resomator/Filter Murata SFSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 7.9x3.8mm^2 package SMD Crystal Oscillator IDT https://www.idt.com/document/dst/xu-family-datasheet#page=15, 5.0x3.2mm SMD Crystal Oscillator Seiko Epson MC-506 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, hand-soldering, 12.7x5.1mm^2 package SMD Crystal FC-135 https://support.epson.biz/td/api/doc_check.php?dl=brief_FC-135R_en.pdf SMD Crystal SERIES SMD3225/4 http://www.txccrystal.com/images/pdf/7m-accuracy.pdf, 3.2x2.5mm^2 package SMD Crystal MicroCrystal CC4V-T1A series http://cdn-reichelt.de/documents/datenblatt/B400/CC4V-T1A.pdf, hand-soldering, 5.0x1.9mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 7.0x5.0mm^2 package SMD Crystal TXC 9HT11 http://txccrystal.com/images/pdf/9ht11.pdf, hand-soldering, 2.0x1.2mm^2 package SMD Resomator/Filter Murata CSTCE, https://www.murata.com/en-eu/products/productdata/8801162264606/SPEC-CSTNE16M0VH3C000R0.pdf SMD SMT SPST EVQPUK EVQPUB SMD SMT SPST EVQP2 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE7.pdf Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 20 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4320fb.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-2421 (alternative finishes: 43045-202x), 10 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Capacitor SMD 2225 (5664 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator connector JST EH series connector.

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