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Dual Flat No Lead Package (MC) - 2x3x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils.

0.0815232 -0.828672 0.553766 facet normal -0.737769 -0.601732.
0.0974418 0.108212 facet normal 1.489235e-15.
Pin pitch=32mm, , length*diameter=23.37*12.7mm^2.

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