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1x38 2.00mm single row style2 pin1 right Through hole straight socket strip, 2x28, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x23, 2.00mm pitch, double rows Through hole pin header SMD 1x11 2.00mm single row style2 pin1 right Through hole angled socket strip THT 1x15 1.00mm single row style2 pin1 right Through hole IDC header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted socket strip THT 1x39 2.54mm single row Through hole angled pin header SMD 1x02 1.00mm single row style2 pin1 right Through hole angled socket strip THT 2x35 1.27mm double row Through hole straight socket strip, 2x04, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x28 2.00mm single row Surface mounted pin header THT 1x37 2.54mm single row Through hole pin header SMD 1x16 2.00mm single row Surface mounted pin header SMD 2x11 2.54mm double row Through hole straight pin header, 1x07, 1.00mm pitch, 2.0mm pin length, double rows Through hole straight pin header, 1x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 2x16 2.00mm double row Through hole angled socket strip SMD 1x08 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x01 2.54mm double row Through hole angled pin header, 2x05, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header THT 2x26 2.54mm double row Through hole socket strip THT 1x07 2.54mm single row male, vertical entry, no latches, PN:G125-MVX0605L0X Harwin Gecko Connector, 50 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 1, Wuerth electronics 97730606332 (https://katalog.we-online.com/em/datasheet/97730606332.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition.

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