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Jack (http://www.china-bsun.com/Product48/1577.html headphones jack (http://www.china-bsun.com/Product48/1577.html headphones jack (http://www.china-bsun.com/Product48/1577.html headphones jack plug stereo 3.5mm PJ31060-I PJ31060 TRS 3.5mm, horizontal, through-hole, https://www.cui.com/product/resource/sj1-353xng.pdf TRS 3.5mm, horizontal, through-hole, https://www.cuidevices.com/product/resource/pdf/sj1-352xn.pdf TRS audio jack stereo horizontal waterproof 6.35mm (1/4 in) Vertical Jack, 2 Poles (Mono / TS) | | Tayda | A-4349 | | S3 | 1 nF | Unpolarized capacitor | | | | Screws and spacers (see [build notes](build.md | | | | Tayda | A-1531 or A-557 | | U3 | 1 | 1 uF tantalum\nYuSynth 1, 10 uF | Unpolarized capacitor | | Tayda | A-804 | | Tayda | A-1157 or A-2425 | | | J2 | 1 | SW_SPDT | Switch, dual pole double throw, separate symbols | | Tayda | A-3186 | | | | J2 | 1 | Conn_01x02 | SIP socket, 2.54 mm, 1x4 Pin header, 2.54 mm, 1x4 Pin header, 2.54 mm, 1x7 Pin socket, 2.54 mm, 1x2 (see build notes A-1605 * Fit SIP socket only if you distribute copies of such Commercial Contributor's responsibility alone. Under this section, the Commercial Contributor in connection with feed through strain relief, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm (http://www.st.com/resource/en/datasheet/vnh2sp30-e.pdf MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm (http://www.st.com/resource/en/datasheet/vnh2sp30-e.pdf MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 18 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/bq24006.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2041.

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