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Pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin without exposed pad 8-Lead Plastic Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 5.25 mm (206 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST , Slide, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 5x-dip-switch SPST KingTek_DSHP05TS, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 10x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm.

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