Labels Milestones
BackBGA 256 1 FT256 FTG256 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 1x39, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x32 2.00mm single row Through hole angled pin header SMD 2x17 2.00mm double row Through hole angled socket.
- Vertex 5.60951 0.191567 18.9636.
- Fireball for rev 2 beta master.
- 3.82299 facet normal 0.111558 0.258184 0.959633.
- Size 10.2x8mm^2, drill diamater 1.3mm, pad diameter 3mm.