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8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole IDC header, 2x13, 2.00mm pitch, double rows Through hole angled socket strip, 1x34, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole socket strip THT 1x35 2.00mm single row male, vertical entry, with latches, PN:G125-MVX2605L1X Harwin Gecko Connector, 50 pins, dual row female, vertical entry, strain relief clip Harwin.

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