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BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm LFCSP, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-S (3216-12 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 6.6, Wuerth electronics 9775106960 (https://katalog.we-online.com/em/datasheet/9775106960.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2021, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-1791, 17 Circuits (https://www.molex.com/pdm_docs/sd/2005280170_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 40 Pin (JEDEC MO-153 Var HB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-2410, 24 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 502443-0970 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1104, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wire, basic insulation, conductor diameter 1.7mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-BE-A, 30 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator JST XA series connector, 202396-1507 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.75 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PH.

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