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KingTek_DSHP10TS, Slide, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 4x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 package, like 6-lead dip package for Kodenshi SG-105 with PCB locator, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_qfp_generator.py 64-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, 4x4mm body, pitch 0.5mm, thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin, exposed pad 8-Lead Plastic Dual Flat.

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