3
1
Back

- 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flat, No Lead Package (MF) - 6x5 mm Body [QFN] with thermal pad with vias HTSSOP, 20 Pin (http://www.ti.com/lit/ml/mpqf239/mpqf239.pdf), generated with kicad-footprint-generator.

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