Labels Milestones
BackWLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354.
- = 3.2; mountHoleRad =mountHoleDiameter/2; hwCubeWidth = holeWidth-mountHoleDiameter; offsetToMountHoleCenterY=mountSurfaceHeight/2.
- LED PLCC-2 SMD TOPLED LED PLCC-2 SMD.
- Hardware/PCB/precadsr/ao_tht.pretty/SOT-23_Handsoldering.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/PinHeader_1x02_P2.54mm_Vertical.kicad_mod.
- D3PAK TO-268 D3PAK-3 TO-268-3 SMD package.