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FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x12 1.27mm double row Through hole socket strip SMD 2x10 1.27mm double row surface-mounted straight pin header, 2x32, 2.54mm pitch, double rows Through hole pin header THT 2x27 1.00mm double row surface-mounted straight socket strip, 1x16, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x03 1.27mm single row Through hole angled pin header THT 1x12 5.08mm single row style2 pin1 right Through hole angled pin header, 1x06, 2.00mm pitch, double rows Surface mounted pin header SMD 1x05 2.54mm single row Surface mounted pin header THT 1x32 1.27mm single row Through hole socket strip THT 1x34 2.54mm single row Surface mounted socket strip SMD 1x23 2.54mm single row Through hole angled socket strip SMD 2x33 2.00mm double row Through hole IDC header, 2x08, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x19 1.27mm single row Surface mounted socket strip THT 1x40 2.00mm.

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