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X-staggered 18x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900.

• Vertex -0.99264 -7.2327 7.55007 facet.
• 1766343 12A 630V Generic Phoenix Contact SPT 2.5/10-H-5.0-EX.

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