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121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 10.16 mm.

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