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Body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of TO-92), also known as TO-226, wide, drill 0.75mm, handsoldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92Mini package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf TO-92S package, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 14 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 5.45mm TO-247-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-7 Vertical RM 5.45mm TO-264-3, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 2.54mm TO-220-5, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-11, Horizontal, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.7mm IIPAK I2PAK TO-264-2, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 2.54mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 4.58mm IPAK TO-251-3, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 10.9mm TO-247-3, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.54mm staggered type-1 TO-220-5, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-4, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-5.

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