Labels Milestones
BackSocket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213.
- 25x12.5mm^2, drill diamater 1.3mm, pad diameter 2.2mm.
- Vertex -1.043643e+02 9.665134e+01 1.174747e+01.