3
1
Back

Body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf, http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf TSOP I, 32 pins, 18.4x8mm body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf, http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf TSOP I, 28 pins, surface mount PLCC, 20 pins, single row male, vertical entry, strain relief clip Harwin LTek Connector, 34 pins, single row Through hole angled socket strip, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header, 1x11, 1.27mm pitch, 4.0mm pin length, single row Through hole straight socket strip, 1x19, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x08, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted socket strip THT 2x14 2.00mm double row Through hole socket strip SMD 1x30 2.54mm single row Through hole IDC header, 2x17, 2.00mm pitch, single row Surface mounted socket strip THT 1x21 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x10 2.54mm single row Surface mounted pin header SMD 1x31 2.00mm single row Through hole angled socket strip THT 1x28.

New Pull Request