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06 top-side contacts, 0.5mm pitch, 1.854mm thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT791-1.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0014 example for new part number.

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