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484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight socket strip, 1x22, 2.00mm pitch, single row Surface mounted socket strip THT 1x39 2.00mm single row Through hole angled socket strip, 1x32, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x26, 1.00mm pitch, single row Surface mounted socket strip SMD 2x14 1.27mm double row Through hole angled pin header, 2x13, 2.54mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x06, 2.54mm pitch, 8.51mm socket length, double rows Through hole.

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