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EC6Cxx, single output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf Abracon Miniature Ceramic Smd Crystal ABM3B http://www.abracon.com/Resonators/abm3b.pdf, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL ZIF 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD.

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